Process Optimization, die pick-and-place processes, reflow curing processes

lean methodology , Prototyping, RCA methods, Test manufacturing, Failure Analysis, Electronic design simulation, Troubleshooting, Optimization, Six Sigma, Electronic circuit analysis

equipment qualification, SMT reflow soldering, Fmea, Sops, process control plans, defect reduction, post-reflow cleaning processes, Root Cause Analysis, SPC monitoring, process troubleshooting, continuous process optimization, yield improvement