Plating process improvement, Dmaic, Chemical processes, JDI methodologies, NX or equivalent CAD software, Tooling Design, Lean Six Sigma

Electronics Manufacturing, Semiconductor, Troubleshooting, manufacturing, Presentation Skills, sputter systems, Technical Report Writing, Problem-solving

sputter process improvement, vacuum technology, Fmea, process characterization, magnetic thin-film deposition, Six Sigma, thin-film manufacturing processes, sputter systems

Leadership, Troubleshooting, Presentation Skills, Technical Report Writing, sputter systems, Problem-solving

SPC monitoring, New product qualification, Recipe tuning and optimization, Process improvement, Sputter systems, Process Documentation, Yield improvement

Microsoft Office, Automation improvement, Lean Manufacturing, Line setup, Cad Drafting, Manufacturing Engineering, Troubleshooting, Equipment readiness, Product transfer projects, Minitab, Standard shop floor inspection equipment, Electric motor testing, Process Validation, BOM setup in ERP system, Mechanical Engineering, Programming instrumentation

Plating process improvement, Dmaic, Chemical processes, JDI methodologies, NX or equivalent CAD software, Tooling Design, Lean Six Sigma