Assembly Process Development Engineer - Molding/Grinding/Panel release/RNT M/F

Responsibilities:

. To setup Assembly Molding, Grinding Process, Panel release & RNT.

. To develop and to industrialize assembly Molding, Grinding Process, Panel release & RNT process for new packages, introduce materials to meet the quality, yield, and mission of new application.

. To support assembly of engineering sample for new packages or new technologies.

. To characterize assemble Molding, Grinding Process, Panel release & RNT process and materials.

. To generate and update process specifications, SOP, FMEA and process control plan.

. To provide technical support when there are critical quality concerns related to assembly EOL material / process.

Requirements:

. More than 3 years working experience.

. Masters/Bachelor's Degree in Engineering (Mechanical / Electrical / Electronics / Microelectronics / Mechatronics / Semiconductor Technology, Material science) or equivalent.

. Equipped with statistical data analysis, analytical and problem-solving skills especially at assembly EOL process.

. Systematic Problem-Solving methodology e.g., 8D, DMAIC, Process Mapping, Fish Bond, Is/is notetc.

. Ability to anticipate issues and challenges and resolving them quickly. Good knowledge and skills in production area.

. Practice high performance behavior and together work as Team in executing projects & strive for excellent.