Assembly Process Development Engineer - Molding/Grinding/Panel release/RNT M/F

5 months ago 5 Applied
Job Description

Job description


. To setup Assembly Molding, Grinding Process, Panel release & RNT.

. To develop and to industrialize assembly Molding, Grinding Process, Panel release & RNT process for new packages, introduce materials to meet the quality, yield, and mission of new application.

. To support assembly of engineering sample for new packages or new technologies.

. To characterize assemble Molding, Grinding Process, Panel release & RNT process and materials.

. To generate and update process specifications, SOP, FMEA and process control plan.

. To provide technical support when there are critical quality concerns related to assembly EOL material / process.



. More than 3 years working experience.

. Masters/Bachelor's Degree in Engineering (Mechanical / Electrical / Electronics / Microelectronics / Mechatronics / Semiconductor Technology, Material science) or equivalent.

. Equipped with statistical data analysis, analytical and problem-solving skills especially at assembly EOL process.

. Systematic Problem-Solving methodology e.g., 8D, DMAIC, Process Mapping, Fish Bond, Is/is notetc.

. Ability to anticipate issues and challenges and resolving them quickly. Good knowledge and skills in production area.

. Practice high performance behavior and together work as Team in executing projects & strive for excellent.

STMicroelectronics is a Franco-Italian multinational electronics and semiconductors manufacturer headquartered in Plan-les-Ouates near Geneva, Switzerland. The company resulted from the merger of two government-owned semiconductor companies in 1987: "Thomson Semiconducteurs" of France and "SGS Microelettronica" of Italy. It is commonly called "ST". While STMicroelectronics corporate headquarters and the headquarters for EMEA region are based in the Canton of Geneva, the holding company, STMicroelectronics N.V. is incorporated in the Netherlands.

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