About the role
Carsem is a global semiconductor assembly and test leader with over 30 years in power packaging and more than 15 years of copper clip development. As wide-bandgap (SiC and GaN) devices reshape power electronics for automotive, industrial, AI and computing, we are seeking a Head of Research & Development to lead the technology and R&D strategy for our Wide-Bandgap business.
Reporting to the General Manager – WBG, you will own the technology roadmap, the R&D pilot line, and the commercialization of next-generation power packaging solutions.
What you will do
- Define and drive the R&D and technology roadmap for SiC and GaN power semiconductor packaging
- Lead development and industrialization of advanced interconnect and assembly technologies, including silver/copper sinter die attach, copper clip, DBC/AMB substrates, encapsulation and thermal management
- Take new packages, materials and processes from concept through pilot line to qualified mass production
- Oversee R&D pilot line operations, modeling and simulation, and continuous improvement
- Act as senior technical partner to customers on new product, material and process development
- Lead value engineering and materials cost reduction without compromising reliability
- Manage patent and IP strategy across Carsem M-site and S-site
- Build and lead a multidisciplinary R&D organisation, developing internal power packaging capability
What you will bring
- Senior R&D or technology development leadership in semiconductor packaging, with a proven track record in power packaging (power modules and/or power discretes)
- Direct experience in wide-bandgap (SiC and/or GaN) power device packaging
- Deep command of assembly and test processes, IC and power packaging materials, and the reliability physics of high-power, high-temperature packages
- Proven success industrializing new packages from development through qualification to mass production, including automotive-grade qualification
- Strong project management to mass production, budgeting, business planning and lean manufacturing knowledge
- Demonstrated people leadership at scale, leading teams and managers with accountability for performance and development
- Bachelor's Degree in Electrical & Electronic Engineering, Physics, Materials Science or equivalent; postgraduate qualification an advantage
Advantageous
- Hands-on knowledge of sinter die attach (Ag/Cu), copper clip, DBC/AMB substrates and advanced thermal management
- Exposure to automotive power electronics, EV traction inverters, or industrial and renewable power applications
- Experience across multi-site technology transfer and global R&D collaboration
