Pre-Assy and Die Attach Process Development Engineer M/F

Responsibilities:

. To setup pre-assy and die attached Process.

. To develop and to industrialize pre-assy process including lamination, Back-grinding, polishing, mounting, wafer saw and laser groove process for new packages, introduce materials to meet the quality, yield, and mission of new application.

. To develop and to industrialize die attach process including glue, soft solder, DAF and flip-bond die attach for new packages, introduce materials to meet the quality, yield and mission of new application.

. To support assembly of engineering sample for new packages or new technologies.

. To characterize pre-Assy and die attach process and materials.

. To generate and update process specifications, SOP, FMEA and process control plan.

. To provide technical support when there are critical quality concerns related to pre-assy and die attached material / process.

Requirements:

. More than 3 years working experience.

. Masters/Bachelor's Degree in Engineering (Mechanical / Electrical / Electronics / Microelectronics / Mechatronics / Semiconductor Technology, Material science) or equivalent.

. Equipped with statistical data analysis, analytical and problem-solving skills especially at Pre-ASSY and die attach process.

. Systematic Problem-Solving methodology e.g., 8D, DMAIC, Process Mapping, Fish Bond, Is/is notetc.

. Ability to anticipate issues and challenges and resolving them quickly. Good knowledge and skills in production area.

. Practice high performance behavior and together work as Team in executing projects & strive for excellent.