(Location can be either Singapore, Malaysia or Thailand)

We are seeking a highly skilled Product Engineering Leader with strong hardware development experience and deep knowledge of optical module and high-speed hardware design. In this role, you will partner closely with design engineering during product development and NPI, ensuring design robustness, manufacturability, and smooth transition to volume production. You will also drive sustaining engineering, yield improvement, and cost optimization for high bit-rate optical coherent transponders.

Key Responsibilities

Development & NPI

Collaborate closely with hardware design engineering during early development to influence architecture, component selection, and design robustness.
Perform and lead DFX (DFM/DFT/DFR) reviews to ensure high manufacturability and reliability before release to production.
Validate design through correlation of simulation, bench characterization, and manufacturing test results across device, module, and subsystem levels.
Approve and drive readiness for volume manufacturing for new products.

Sustaining Engineering & Optimization

Lead yield improvement programs, driving product, process, and test enhancements.
Own debug, failure analysis, and RMA activities, ensuring root-cause identification and timely corrective actions.
Analyze electrical/optical key parameters and define/optimize test limits, guard-bands, and screening strategies.
Develop and maintain product troubleshooting guides, debug flows, and technical documentation.

Cost & Operations

Support cost modeling and lead cost-reduction efforts with cross-functional teams.
Partner with contract manufacturers and suppliers to resolve technical issues and ensure product quality and performance.

Minimum Qualifications

BS degree in Electrical Engineering, Physics, or a closely related field.
5+ years of experience in hardware development, including exposure to electronic/optical circuit design, validation, and NPI.
Hands-on experience with optical module production for QSFP-DD, OSFP, CFP2, QSFP-112 or similar formats.
Strong understanding of 100G / 200G / 400G / 800G / 1.2T optical module architectures, specifications, and test requirements.
Solid knowledge of high-speed analog/digital circuits, RF fundamentals, signal integrity, optical communication components, and relevant debugging tools.
Ability to lead cross-functional teams to drive technical resolutions.
Excellent communication skills in English, both written and verbal.

Preferred Qualifications

Strong statistical analysis experience (JMP, Minitab, Python, etc.).
Proven problem-solving and root-cause analysis capabilities.
Experience in reliability engineering for telecom-class or high-speed hardware products.

Additional Information

Some travel may be required.

Product Engineer

CO-OP/INTERN

Hardware Design Engineer

Machining Instructor Team Lead

Test Engineer (Debug/ Functional Test/AOI/AXI)