Your Role

Key responsibilities in your new role

Perform IC (functional) Failure Analysis [FA] on wafer and package level starting from electrical verification, fault isolation and physical root cause analysis.
Prepare FA reports that can lead to root cause finding and corrective action to cross functional team. Participate, lead and present FA results in cross functional meetings, projects, yield improvement, urgent and important meetings.
FA equipment / tool ownership.
Interface with designers, test, product, process integration and unit process engineers, problem solving team, CQM (customer quality management) team to understand the analysis requirement.
Responsible for achieving EFA KPIs.
Setup of application board, product specific test methodology and localization capability.
CAD navigation, layout and schematic analysis to identify the failure location and hypothesis.
Responsible for Fault Tree Analysis (FTA) in case of no physical defect found.

Your Profile

Qualifications And Skills To Help You Succeed

Qualification: Degree / Master / PhD in Electrical and Electronic Engineering Technical Skills:

Advanced electrical failure verification and localization, i.e. bench testing for IV curve & functional verification, die front/back-side localization, electrical micro-probing with passive & active probe, OBIRCH/TIVA/SEI localizations.
Advanced sample preparation, i.e. wet/dry chemical, backside preparation, package preparation.
Imaging for defect visualization, i.e. optical, SEM and FIB (incl. Voltage Contrast).
Repackaging skill i.e. Chip On Board (COB).
Basic CAD Navigation System.
Semiconductor processing, fabrication, device and testing knowledges.

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Are you in

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Staff Engineer Failure Analysis