SPI equipment, Algorithm Maintenance, Hardware Monitoring, Technical Support, AOI equipment, Process Improvement, AXI 5DX X-ray inspection, AI Integration

Technical Documentation, wafer testing, process integration

Ms Excel, Autocad

process flow , Prototyping, Testing, Lean, Fmea, Process Capability, Mechanical Engineering, Reliability

Statistical Analysis, Dmaic, Process improvement, Lean methodologies, Process development, New Product Introduction, Visual inspection systems, DFSS, Pfmea, manufacturing automation

Die bonding techniques, Die Attach and Flip Chip processes, Flip chip assembly, Failure Analysis, Reliability Testing, Underfill processes, Solder bump micro-bump technology