Company Description

Sandisk understands how people and businesses consume data and we relentlessly innovate to deliver solutions that enable today's needs and tomorrow's next big ideas. With a rich history of groundbreaking innovations in Flash and advanced memory technologies, our solutions have become the beating heart of the digital world we're living in and that we have the power to shape.

Sandisk meets people and businesses at the intersection of their aspirations and the moment, enabling them to keep moving and pushing possibility forward. We do this through the balance of our powerhouse manufacturing capabilities and our industry-leading portfolio of products that are recognized globally for innovation, performance and quality.

Sandisk has two facilities recognized by the World Economic Forum as part of the Global Lighthouse Network for advanced 4IR innovations. These facilities were also recognized as Sustainability Lighthouses for breakthroughs in efficient operations. With our global reach, we ensure the global supply chain has access to the Flash memory it needs to keep our world moving forward.

Job Description

ESSENTIAL DUTIES AND RESPONSIBILITIES:

Develops and leads SiP (System in Package) assembly and IC packaging material and processes to meet quality, reliability, cost, yield, productivity and manufacturing requirements.
Leads new package and SMT/Flip Chip/Underfill process qualification programs.
Develops and maintain process documentation, including standard operating procedures and work instructions.
Plans and conducts experiments to fully characterize material and processes throughout pathfinding to development to ramp.
Develops solutions to improve quality, reliability, cost, yield, process stability/capability, productivity utilizing statistical knowledge, and problem-solving tools.
Establishes process control systems. Transfers process to high volume manufacturing and provide support in new factory start-up.
Acts as a liaison with suppliers/vendors.
Maintains product quality while developing and introducing package cost reduction programs.
Coordinates and leads the introduction of new package processes into production.
Collaborate with cross-functional teams to lead FC team to drive continuous improvement projects.
Collaborate closely with process, equipment, factory automation and IT teams to deliver robust and efficient automation solutions.

Qualifications

REQUIRED:

Bachelor/Master/PhD engineering/material/science required plus min 8 years of relevant work experience, min 5 year for PhD.
Relevant work experience must be in engineering role within semiconductor industry.
Academic studies must be in applicable field of engineering/science and demonstrate an academic record of excellence.

Preferred

Track record of AI/ML experience is added advantage.
Proficiency in statistical data analysis and process simulation software.
Demonstrated track record to pathfinding and development new SMT/FC/UF material such as paste and epoxy with vendors and utilizing test methodology to qualify new material in factory.
Demonstrated track record to rapidly analyze and solve complex engineering issues by pursuing a focused solution path with a clear understanding of technical fundamental on root causing thru failure analysis report (EDX/FTIR etc), simulation report, mechanical (shadow moire) analysis report, or any relevant metrology data collection.
Strong attention to detail and commitment to achieving goals.
Ability to adapt to changing priorities and work efficiently in a fast-paced environment.

Skills

Strong troubleshooting and analytical skills with the ability to collect, organize, analyze, and understand problems and conceptualize solutions.
Passion, determination to uncover the root cause and derive a long-term solution, using quality tools such as FMEA, 8D, MBPS, DMAIC.
Excellent communication and collaboration skills.
Good at mind mapping and proficient in MS Excel, MS Project, and PowerPoint presentation.
Understanding of SQL query writing (Oracle / Microsoft SQL Server) and JMP is a plus.
Ability to communicate with different hierarchy levels from diverse geographical areas and cultures.
Strategically focused, impact-oriented, highly organized, and adaptable.
Exposure to Industry 4.0 technologies, real-time dashboards, or digital transformation initiatives in manufacturing.

Additional Information

Sandisk thrives on the power and potential of diversity. As a global company, we believe the most effective way to embrace the diversity of our customers and communities is to mirror it from within. We believe the fusion of various perspectives results in the best outcomes for our employees, our company, our customers, and the world around us. We are committed to an inclusive environment where every individual can thrive through a sense of belonging, respect and contribution.

Sandisk is committed to offering opportunities to applicants with disabilities and ensuring all candidates can successfully navigate our careers website and our hiring process. Please contact us [HIDDEN TEXT] advise us of your accommodation request. In your email, please include a description of the specific accommodation you are requesting as well as the job title and requisition number of the position for which you are applying.

NOTICE TO CANDIDATES:Sandisk has received reports of scams where a payment is requested on Sandisk's behalf as a condition for receiving an offer of employment. Please be aware that Sandisk and its subsidiaries will never request payment as a condition for applying for a position or receiving an offer of employment. Should you encounter any such requests, please report it immediately toSandisk Ethics Helpline or email [HIDDEN TEXT].

Principal Engineer, Packaging Engineering