industry standard reliability test methods, semiconductor component package assembly processes, hygroscopic swelling stresses, sampling statistics, mechanical and material interaction effects on reliability

SAP, Microsoft Office, Oracle, Iso 13485, Fmea, Spc, Statistics, Supplier Qualification Audits, APQP, Minitab, Supplier Quality Management System, Ppap, Sampling Plans, Lean Manufacturing, Six Sigma, Msa

statistical analysis methods, material characterization techniques, 8D methodologies, Doe, battery testers, Fmea, Spc, battery chemistry