Windows Office, fib, Minitab, Fmea, Spc, AFM, EDX, 5 Whys, Sem, Jmp

SAP, Microsoft Office, Data Analytics, Minitab, Fmea, Spc, Msa

solution implementation , Debugging, Soc, electronic engineering, Teradyne Nextest Magnum 1 2 2X, Electronic circuitry knowledge, Electronics, Statistical evaluation, Electrical test failure analysis, Mixed-signal devices, Root Cause Determination, CMOS, Semiconductor devices operation, Ate, Product qualification, Advantest V93000, Statistical 8D Mythology, Quality Tools, System-level testing analysis

Windows Office, fib, Minitab, Fmea, Spc, AFM, 5 Whys, EDX, Sem, Jmp

Ms Excel, Solidworks, Six Sigma methodologies, preventive maintenance programs, Thin Film PVD CVD process equipment, GX Developer, HMI GOT Mitsubishi GT Designer, diagnostic tools, Plc Programming, vacuum systems, thin-film deposition techniques, Technical Writing

DFM assessment and NUDD risk management, DOE Mechanical and Material Lab Tools Failure Analysis knowledge, Green Belt Black Belt certification, Quality Tools FMEA 8D DMAIC IPC knowledge, SMT material and process development, Stencil design development for new components, SMT AI ML integration development, Statistical Tools Statistical analysis JMP Minitab

Jmp, Data manipulation and analysis, Integrated Circuit semiconductor process, Exenso, Pdf, Product Test Knowledge, Products IC modules such as Driver Power Stage

Windows Office, fib, Minitab, Fmea, Spc, AFM, EDX, 5 Whys, Sem, Jmp