wire bonding, Data Analysis, die bonding, Spc, back-end assembly processes, Troubleshooting, Doe, yield improvement, process setup optimization, process characterization, statistical methods, CPK

Statistical Analysis, Dmaic, Process improvement, Lean methodologies, Process development, New Product Introduction, Visual inspection systems, DFSS, Pfmea, manufacturing automation

Sql, Tensorflow, Python, Opencv, AI-based tools, Cognex vision systems, Image processing algorithms, PLC integration

Maintenance and repair activities, Process development, Excursion prevention systems, Continuous Improvement, Manufacturing equipment, Production efficiencies

DFM assessment and NUDD risk management, DOE Mechanical and Material Lab Tools Failure Analysis knowledge, Green Belt Black Belt certification, Quality Tools FMEA 8D DMAIC IPC knowledge, SMT material and process development, Stencil design development for new components, SMT AI ML integration development, Statistical Tools Statistical analysis JMP Minitab