statistical data analysis , Microsoft Sql Server, Oracle, SMT Flip Chip Underfill process qualification, Jmp, SQL query writing, Industry 4.0 technologies, Fmea, process simulation software, 8D, Dmaic, SiP System in Package assembly, IC packaging material and processes, MBPS

Iso9001, ISO TS16949, Fmea, Control Plan, Supplier Quality Management, Quality Documentation, Iso14001