Electrical verification, Thermal HS Imaging, Fault isolation methodologies, OBIRCH, 2D 3D X-Ray, CAD and schematic interpretation, C-SAM, Parametric Analyzer, Bench Set Up for Functional Failures, Package level and die level delayering and cross-sectioning, EDX, Physical failure analysis, Root cause analysis methodologies

Artificial Intelligence, fib, OBIRCH, Thermal emission, die deprocessing, Bench test setup, FESEM, verification fault isolation equipment, silicon level failure analysis, nano-probing