Windows Office, fib, Minitab, Fmea, Spc, AFM, EDX, 5 Whys, Sem, Jmp

Ms Excel, Solidworks, Six Sigma methodologies, preventive maintenance programs, Thin Film PVD CVD process equipment, GX Developer, HMI GOT Mitsubishi GT Designer, diagnostic tools, Plc Programming, vacuum systems, thin-film deposition techniques, Technical Writing

DFM assessment and NUDD risk management, DOE Mechanical and Material Lab Tools Failure Analysis knowledge, Green Belt Black Belt certification, Quality Tools FMEA 8D DMAIC IPC knowledge, SMT material and process development, Stencil design development for new components, SMT AI ML integration development, Statistical Tools Statistical analysis JMP Minitab

Windows Office, fib, Minitab, Fmea, Spc, AFM, 5 Whys, EDX, Sem, Jmp

SAP, Microsoft Office, Data Analytics, Minitab, Fmea, Spc, Msa

assembly processes , Microsoft Office, Troubleshooting, Process Validation, Product transfer projects, Mechanical and machining processes, Lean Manufacturing, Cad Drafting, Standard shop floor inspection equipment, Minitab

Jmp, Data manipulation and analysis, Integrated Circuit semiconductor process, Exenso, Pdf, Product Test Knowledge, Products IC modules such as Driver Power Stage

Chiplet packaging, EFB, Flip Chip, CoWoS-L, LGA, InFO Bumping, 3D TSV Packaging, Jmp, WLFO, FCBGA, Doe, CoWoS-S

Chiplet packaging, EFB, Flip Chip, CoWoS-L, LGA, InFO Bumping, 3D TSV Packaging, Jmp, Chip-Packaging Interaction knowledge, WLFO, FCBGA, Doe, CoWoS-S