SPI equipment, Algorithm Maintenance, Hardware Monitoring, Technical Support, AOI equipment, AXI 5DX X-ray inspection, AI Integration, Process Improvement

wire bonding, Data Analysis, die bonding, Spc, back-end assembly processes, Troubleshooting, Doe, yield improvement, process setup optimization, process characterization, statistical methods, CPK

Big Data Analytics, Sql, OEE tracking, semiconductor test processes, analytical tools, Fmea, Control Plans, wafer sorting, Burn In test, data-driven problem-solving, yield management systems, IATF 16949 standards, wafer level testing, 8D problem-solving

Statistical Analysis, Dmaic, Process improvement, Lean methodologies, Process development, New Product Introduction, Visual inspection systems, DFSS, Pfmea, manufacturing automation