Windows Office, fib, Minitab, Fmea, Spc, AFM, EDX, 5 Whys, Sem, Jmp

assembly processes , Microsoft Office, Troubleshooting, Process Validation, Product transfer projects, Mechanical and machining processes, Lean Manufacturing, Cad Drafting, Standard shop floor inspection equipment, Minitab

Sem, Jmp, 5 Whys, EDX, AFM, Fmea, Spc, Windows Office, Minitab, fib

semiconductor process , integrated circuit , Jmp, Data manipulation and analysis, Products IC modules, Driver Power Stage, Exenso, Development NPI Product Engineering, Pdf, Product Test Knowledge

WLFO, Jmp, CoWoS-L, InFO Bumping, LGA, 3D TSV Packaging, EFB, Chip-Packaging Interaction knowledge, Flip Chip, Doe, FCBGA, CoWoS-S, Chiplet packaging