Windows Office, fib, Minitab, Fmea, Spc, AFM, 5 Whys, EDX, Sem, Jmp

scientific molding , Injection Molding, Siemens Nx, CPS RJG mold flow simulation, tooling engineering, Industry 4.0, Process Engineering, thermoplastic materials, mold construction, Mold Design, Lean Manufacturing, Six Sigma, automation integration

raman spectroscopy , Statistical Analysis, Test Database systems, Zygo, data visualization tools Spotfire, ESCA, FIB-SEM, failure mode analysis, FA database systems, data interpretation methods, defect characterization techniques, analytical tools such as SEM-EDX, TOF-SIMS, OSA

secs gem , Machine Learning, automation system troubleshooting, Database integration, Process Control, automation software coding, SSD equipment development

Semiconductor Manufacturing Equipment, Process Characterization Techniques, Equipment Monitoring and Adjustment

yield analysis, Product definition, semiconductor digital device testing concepts, project management, Wafer Level Testing Knowledge, semiconductor device fabrication manufacturing processes, wafer process, ATE SLT testing methodology

Data Modeling, Power Bi, Power Query, Sql, Database Management, Data Visualization, Dax, Statistical Analysis, Manufacturing KPI Monitoring, Root Cause Analysis, Process Automation, ETL Processes

decap, Fmea, molding encapsulation, Spc, Plating, cross-section, 8-D, leadframe design considerations, wirebond processes, X-ray, QC FA tools, Doe, clip bonding, Sem