process qualification , change management, Statistical Analysis, manufacturing readiness, advanced interconnect technologies, Quality Control, high-volume manufacturing, DBC, semiconductor packaging assembly, problem-solving methodologies, SiC, GaN, process stability, Quality Systems, process change management, yield performance, AMB substrates

Ce, Lean, Fmea, Spc, 8D, Rca, APQP, Iso 9001, Ppap, Quality Management System, atex, NRTL, Six Sigma