engineering DOE evaluations, wire bond Cu Au wire process, tools jigs fabrication, machine modifications, yield improvement, Training

Teradyne, Correlation, ETS, Fmea, 8D, Jmp, Ate, Minitab, test platform conversion, fish bone, Doe, Tmt

NPI probing technology qualification procedures, statistical-proven experiments, probe wear-out rates, contact resistance, Analyzer, probe-pad-combinations, test benches, prober, probe card, test lab equipment, device characterization

Power Bi, automation, continuous improvement methodologies, digital tools, AI machine learning, Fmea, Spc, Rca, ChatGPT, predictive analytics tools, Microsoft Copilot, Doe

Fmea, Spc, Doe, Equipment Calibration, Quality improvement tools

Microsoft Office, AOI, PCBA cleaning processes, IPC standards, Router equipment, Fmea, Underfill, Press Fit, GR, Dfm, SMT process, Reflow, ASM machines, DEK printers, R, Minitab, MSD requirements, Six Sigma Tools, Wave Soldering, X-ray, Glob Top, CpK, DFM principles

process qualification , SPC monitoring, Material Science and Engineering, Sputter process, Yield improvement, vacuum technology

engineering DOE evaluations, wire bond Cu Au wire process, tools jigs fabrication, machine modifications, yield improvement, Training