SPS solder attach processes, thin wafer handling, Spc, package development, quality and reliability requirements for PQFN QFN and leaded packages, Process Engineering, statistical analysis software such as JMP

Process Documentation, statistical process analysis, manufacturing process technologies, manufacturing techniques, process control methodologies

GaN, gaas, InP, MOCVD technique, SiC, statistical analysis programs

Big Data Analytics, Python, Wafer Fabrication

statistical data analysis , AOI and Automation, Laser marking and printing process engineering