Nexperia is a world-class company in semiconductor development and in-house production. A proven global player with an entrepreneurial mentality. At our core is an 13,000+ strong international network with a singular focus. Built on passion and commitment to our work, belief in our goals and a drive to succeed regardless of the challenges we face. We support, reward and challenge individuals equally, in a dynamic and energetic environment.

About The Role

We are seeking a Senior/Staff Wire Bond Equipment & Process Engineer to join our dynamic team. In this role, you will leverage your expertise in wire bonding technology to optimize semiconductor manufacturing processes and ensure the highest quality and reliability in production. You will work closely with cross-functional teams, including R&D, process engineering, and manufacturing, to drive continuous improvement and innovation.

What You Will Do

Lead the setup, qualification, and optimization of wire bonding equipment and processes (including CZ and DOE activities).
Drive continuous process improvements to enhance yield, reliability, and throughput.
Troubleshoot and resolve equipment and process-related issues in a high-volume manufacturing environment.
Perform disposition of non-conforming materials and implement corrective/preventive actions.
Collaborate with design, quality, and manufacturing teams to support new product introductions (NPI).
Analyze process data, identify trends, and implement data-driven improvements.
Mentor and guide junior engineers; promote knowledge sharing and best practices.
Ensure compliance with safety, quality, and environmental standards.
Develop and maintain documentation such as FMEA, Control Plans, OCAP, and SPC.
Support internal and external audits.
Lead cost reduction and MVA (Manufacturing Value Add) improvement projects.
Perform additional tasks as assigned by management.

What You Will Need

Bachelor's degree in Electrical/Electronic Engineering, Mechanical Engineering, Materials Science, or a related field.
Minimum 5-8 years of experience in wire bonding equipment and semiconductor process engineering.
Strong understanding of thermosonic and ultrasonic wire bonding techniques for Gold and Copper. Others wire type handling is a plus.
Solid Hands-on experience in ASM wire bonders, bonder programming, and process optimization. KNS Hands-on experience is a plus.
Solid analytical and problem-solving skills, with experience using data to drive decisions.
Knowledge of semiconductor manufacturing standards, quality control, and reliability testing.
Statistical Knowledge/Hands-on in JMP, Minitab and/or other statistical tools.
Excellent communication and collaboration skills; ability to work across teams.

Talent acquisition based on Nexperia vacancies is not appreciated. Nexperia job adverts are Nexperia copyright © material and the word Nexperia® is a registered trademark.

D&I Statement

As an equal-opportunity employer, Nexperia values diversity not just because it is the right thing to do but because diverse teams perform better. We are dedicated to being inclusive, and a proof point of this dedication is that we were the main partner of the very first Dutch Paralympic Team NL House during the Paris 2024 Paralympic Games. Our recruitment process is inclusive and accessible to all, and we consider all applicants fairly, as well as providing a safe work environment and reasonable adjustments where requested.

In addition, we offer our colleagues the possibility to join employee resource groups such as the Pride Network Group or global and local Women's groups. Nexperia is committed to increasing women in management positions to 30% by 2030.

Wire Bond Process & Equipment Senior/Staff Engineer