- Responsible for supporting backend process and improvement on assigned packages
- Responsible for quality, yield, cost and process improvement activities.
- Responsible for process documentation, process spec, standard work instruction, OCAP, Lead etc.
- Need to collaborate closely with cross functional team members to resolve conflicts and make fast decision to avoid any risk to the organization/company/customer.
- Take ownership to work closely with peers and management to drive assigned deliverables
Requirements
- Candidate must possess at least a Bachelor's Degree in Engineering (Material Science/Electrical/Mechanical or equivalent).
- 1-2 years of work experience with semiconductor assembly background for automotive customers (Fresh grads are encouraged to apply)
- Candidate must have great interpersonal skills, leadership skills, positive minded, self-driven and eager to strive for success.
- Passionate in continuous learning and drive for improvement
- Good SPC, Process Control and other relevant statistical & problem-solving skills
- Good in Microsoft application (PowerPoint, Excel Macro, Word, Auto CAD, etc.).
- Project management knowledge is an added advantage.
More information about NXP in Malaysia...
