Company Description TF-AMD Penang is a joint venture between Tongfu Microelectronics (TFME), a pioneer in China's OSAT industry, and AMD, a global leader in high-performance computing and graphics technologies. Formed in 2016 through TFME's majority acquisition of AMD's Penang and Suzhou facilities, the JV combines advanced flip-chip packaging and test capabilities with extensive OSAT experience. TF-AMD Penang serves as AMD's main advanced packaging and test supplier while expanding services to a broader range of semiconductor customers worldwide. The company benefits from TFME's strong customer base and culture of continuous improvement, positioning the JV to grow from an IDM-focused operation into a globally competitive OSAT provider. Team members join a large, integrated group with opportunities to work on cutting-edge semiconductor products and technologies.
Role Description The Assembly Equipment Engineer is an on-site role based in Bayan Lepas, responsible for supporting and optimizing semiconductor assembly equipment and processes. This role involves monitoring equipment performance, conducting root-cause analysis for downtime or yield-related issues, and executing corrective and preventive maintenance activities. The engineer collaborates with manufacturing, process, and quality teams to improve equipment reliability, throughput, and product quality, and participates in new equipment installation, qualification, and continuous improvement projects. Daily tasks include troubleshooting mechanical and electrical issues, updating equipment documentation, implementing safety and quality standards, and supporting technology transfers or new package introductions in the assembly lines.
Qualifications
- Technical expertise in semiconductor assembly equipment, including setup, maintenance, troubleshooting, and optimization of automated tools and machinery.
- Strong skills in equipment performance analysis, root-cause problem solving, and continuous improvement using data-driven methods and basic statistical tools.
- Knowledge of semiconductor assembly processes (e.g., die attach, wire bond, molding, singulation, flip-chip packaging) and relevant production workflows.
- Ability to interpret technical drawings, equipment manuals, process specifications, and engineering change documentation.
- Familiarity with manufacturing systems such as MES, equipment monitoring software, and basic PLC or control system concepts.
- Effective communication and collaboration skills to work with cross-functional teams in production, engineering, quality, and facilities.
- Attention to safety, quality, and compliance with industry standards, including EHS practices in a high-volume semiconductor environment.
- Bachelor's degree or equivalent in Electrical Engineering, Mechanical Engineering, Mechatronics, Manufacturing Engineering, or a related field.
- Relevant experience in semiconductor back-end, OSAT, or high-volume manufacturing is an advantage; experience in AMD or similar advanced packaging environments is a plus.
- Ability to work in shifts or flexible hours as required
