Design Engineer

Role: Engineer Design II (IC Package Design)

Location: Virtual Site (Penang, Malaysia)

Work Mode: Fully Remote

We are looking for an experienced IC Package Design Engineer to work on high-density package layout designs across leading semiconductor products such as CPUs, SoCs, chipsets, and test vehicles. You will use Mentor Graphics Xpedition PCB to deliver high-quality substrate designs and collaborate closely with Package Design Engineers to meet design milestones.

Key Responsibilities:

• Perform IC package layout design, routing feasibility, and signal breakout
• Handle low-speed and high-speed IO routing (DDR, PCIe, SERDES), including length matching
• Manage power routing, ball map assignments, and VSS stitching
• Run and clean up DRCs and generate design quality reports
• Ensure designs meet electrical, process, and quality requirements

Requirements:

• Bachelor's or Master's in Electrical / Electronics Engineering or related field
• 3+ years of experience in IC package or board layout design
• Strong hands-on experience with Mentor Graphics Xpedition PCB
• Good English communication and time management skills

Nice to Have:

• Knowledge of DDR / PCIe / SERDES interfaces
• Strong fundamentals in electronics, electromagnetics, or microwave theory