Design Engineer (Semiconductor Assembly)

Responsibilities:

. Define requirements and features for semiconductor equipment

. Develop concepts and architecture of new equipment

. Design mechanical systems which involve the selection and use of motors, actuators, gear drives, pumps and valves.

. Produce detailed engineering drawings

. Perform design verification and validation testing to ensure compliance with specifications, safety regulations and product requirements.

. Improve design of legacy machines

. Application of analysis tools like Fish Bone Diagram, FMEA etc.

Requirements:

. Degree in Mechanical or Mechatronics Engineering

. More than 3 years of experience in automation design

. Good knowledge and experience in the following areas :

1) Design of automation or semiconductor equipment

2) High precision machine design

3) Design of High Speed Pick and Place mechanisms

. Familiar with 3D CAD software

. Equipment troubleshooting skills

. Ability to produce detailed Mechanical drawings and apply knowledge of Geometric Dimensioning &Tolerancing.

. Able to travel overseas for field support when required

. Must be prepared to work overtime when necessary

To find out more about this opportunity, please contact Lionel Liew at [Confidential Information].

We regret that only shortlisted candidates will be notified.

GMP Technologies (S) Pte Ltd | EA Licence: 11C3793 | EA Personnel: LionelLiew | Registration No: R1330693