Develop and optimize FOL/EOL processes; especially Die Attach process for new product development project to meet project cost, quality and timeline targets.
Participate and support FOL/EOL processes technology roadmap and building block activities.
Equipment selection which meet project cost, quality and timeline target.
Share and transfer technical know how within R&D and to Manufacturing team.
Provide technical guidance or job coaching to junior supporting staff.
Participate in engineering sample, pre-series and ramp-up build to fulfill customer order.
Requirement
Degree or Master in Electrical / Electronics / Mechatronics / Mechanical Engineering or equivalent.
5 years in semiconductor field especially in Die Attach process development.
Process engineering knowledge in semiconductors or LED manufacturing processes.
Knowledge in process development step and statistic.
