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Job Description:
The Operations Manager is responsible for overseeing the daily operations of the manufacturing plant, ensuring efficiency, productivity, and quality standards are met. This role requires strong leadership, problem-solving skills, and the ability to manage multiple departments, including production, engineering, quality control, and supply chain management, to drive business success. Additionally, this role will oversee key Wire Bond & Mold processes to ensure optimal performance in semiconductor packaging.
Key Responsibilities:
Oversee daily operations of the manufacturing plant, ensuring smooth workflow and operational efficiency.
Develop and implement strategies to optimize manufacturing processes, reduce costs, and improve overall performance.
Monitor Key Performance Indicators (KPIs) such as OEE, yield, cycle time, and production efficiency to ensure targets are met.
Lead and supervise teams across different departments, fostering a collaborative and high-performance culture.
Ensure on-time delivery of products while maintaining high quality and safety standards.
Implement and oversee Lean Manufacturing, Six Sigma, and other continuous improvement initiatives.
Ensure compliance with industry regulations, ISO standards, safety protocols, and company policies.
Collaborate with senior management to develop and execute business growth strategies and capacity planning.
Identify and address bottlenecks, operational inefficiencies, and production challenges, implementing corrective actions as needed.
Manage budgets, forecasts, cost controls, and resource allocation to ensure financial efficiency.
Oversee supply chain, procurement, and logistics to ensure timely availability of raw materials and components.
Work closely with HR to manage staffing, training, and performance evaluation to build a strong workforce.
Support customer service and technical teams by ensuring product quality and timely issue resolution.
Drive automation and Industry 4.0 initiatives to enhance operations and efficiency.
Analyze operational data, generate reports, and present insights for management decision-making.
Maintain Wire Bond & Mold processes to meet plant KPI goals, targeting 99.98% wire bond yield with an aim for 99.99%.
Ensure proper Control Plan, FMEA, Spec, and SPC review for wire bond and mold processes.
Monitor and improve OS yield loss, maintaining it at 0.3% or lower.
Lead efforts in resolving cratering issues for sensitive pad structures and improving productivity through program merging and WPS enhancements.
Drive cost-saving projects such as Long Cap Limit studies, capillary design improvements, and material transitions from Au to Cu.
Oversee automation and alarm management systems, including Auto Recipe Downloading and Auto System Lot Hold.
Champion Automotive System Controls and ensure compliance with industry standards.
Provide direct involvement in customer complaints, root cause analysis, and yield improvement initiatives.
Lead Die Attach (DA) and Die Sort (DS) process improvements, focusing on minimizing conversion time and addressing thin die crack issues.
Job ID: 106845663