Company Description
Nexperia, headquartered in the Netherlands, is a globally recognized semiconductor company with over 10,000 employees across Europe, Asia, and the United States. Specializing in essential semiconductors, Nexperia powers a wide array of electronic designs in industries such as automotive, industrial, mobile, and consumer applications.Nexperia's innovation and commitment to sustainability and quality are supported by its industry certifications, including IATF 16949, ISO 9001, ISO 14001, and ISO 45001.
Role Description
This is a full-time on-site role for FA Package & Die level, located at Nexperia's facility in Seremban. The technician will be responsible for performing failure analysis on semiconductor packages and dies, conducting root cause investigations, and supporting the development and optimization of processes. The role involves using specialized tools and equipment for failure analysis purposes, documentation, and collaborating with engineering team to implement improvements. Additionally, the technician will ensure that all activities align with Nexperia's quality and efficiency standards.
Qualifications
- Proficiency and hand on in failure analysis techniques, including curve tracer,device application test,external & internal visual inspection ,SAM,micro-probing ,EMMI & OBIRCH fault isolation ,Cadence LVS,Sample preparation, microscopy ,sem& edx,and FIB.
- Knowledge of semiconductor packaging & die technologies.
- Strong analytical and problem-solving skills to investigate root causes and recommend process improvements.
- Experience with technical documentation, FA report preparation, and data interpretation tools.
- Ability to collaborate with cross-functional teams, including engineering and quality assurance, to implement corrective measures.
- Diploma in Electronics, Physics, Materials Science, or a relevant technical field.
- Proactive and detail-oriented, with a commitment to quality and continuous improvement.
