Failure Analysis

Job Summary

We are seeking a highly motivated and experienced Failure Analysis Engineer to perform advanced failure analysis investigations and support root cause identification for semiconductor products. The successful candidate will be responsible for conducting physical failure analysis, utilizing various analytical techniques and sample preparation methods, driving technical problem-solving activities, and collaborating with cross-functional teams to improve product quality and reliability.

Key Responsibilities

• Perform comprehensive physical failure analysis (FA) on semiconductor products to identify failure mechanisms and root causes.
• Conduct sample preparation and analysis using techniques such as:
• Scanning Electron Microscopy (SEM)
• Focused Ion Beam (FIB)
• X-ray analysis
• Mechanical cross-sectioning
• Chemical decapsulation (Decap)
• Analyze failure results and provide detailed technical reports with corrective action recommendations.
• Support product development, manufacturing, quality, and reliability teams in failure investigations.
• Lead complex technical problem-solving activities and drive root cause analysis initiatives.
• Participate in customer complaint investigations and quality improvement programs.
• Apply quality tools and methodologies such as FMEA, 8D, and statistical analysis techniques.
• Develop and optimize failure analysis methodologies, procedures, and best practices.
• Present technical findings to management, customers, and cross-functional stakeholders.
• Mentor junior engineers and provide technical leadership within the team.
• Collaborate with global teams across multiple locations to support business objectives.