Remark:
- There are several job openings for Failure Analysis Technicians, ranging from fresh graduate to senior levels, at the Batu Kawan & Bayan Lepas plants.
Job Summary
The Package Failure Analysis Technician is responsible for performing detailed hands-on analysis of semiconductor packages to identify defects and determine root causes of failures. This position plays a key role in supporting quality improvement initiatives, reliability investigations, and customer return analysis through the use of advanced failure analysis tools and techniques.
Key Responsibilities
- Execute failure isolation and root cause analysis on semiconductor packages and assemblies.
- Prepare samples using techniques such as cross-sectioning, polishing, delayering, and decapsulation.
- Operate advanced analytical and sample preparation equipment, including: Mechanical grinders (manual and automated), Scanning Electron Microscope (SEM), Focused Ion Beam (FIB), X-ray and optical inspection systems, Acoustic microscopy, Energy-dispersive X-ray spectroscopy (EDX), Dry and wet etching processes, IV Curve Tracing (IV CT) and Time Domain Reflectometry (TDR) for fault isolation
- Collaborate with engineers to support corrective actions, process improvements, and prepare comprehensive failure analysis reports.
- Maintain laboratory equipment and ensure adherence to safety and cleanliness standards.
- Monitor and enhance sample preparation efficiency and quality.
Qualifications
- Associate degree in Electronics, Materials Science, or a related technical field.
- Minimum 2-5 years of experience in semiconductor failure analysis or related laboratory work.
- Fresh graduate are welcome to apply.
- Basic understanding of semiconductor packaging and electronic schematics.
- Proficiency in Microsoft Office for documentation and reporting.
Preferred Skills and Attributes
- Hands-on experience with failure analysis tools such as SEM, FIB, SAT, mechanical grinding, and chemical etching.
- Knowledge of reliability testing and equipment operation is an advantage.
- Familiarity with package-level failure modes.
- Strong analytical and problem-solving skills with the ability to work in a fast-paced environment.
- Effective communication skills for cross-functional collaboration.
- Discipline, positive attitude, and patience in conducting failure and reliability analysis.
- High attention to detail and ability to manage multiple tasks.
- Competence in report writing and data interpretation.
Key Performance Indicators (KPIs)
- Turnaround time for failure analysis reports.
- Accuracy and completeness of root cause identification.
- Compliance with safety and quality standards.
- Equipment uptime and maintenance adherence.
- Customer satisfaction with analysis reports.
