Position Summary
We are seeking an experienced and strategic Director / Head of FOL & EOL Engineering to lead semiconductor backend assembly engineering across Front-of-Line (FOL) and End-of-Line (EOL) operations. This role is responsible for driving engineering excellence, process optimization, technology deployment, yield improvement, and manufacturing support within a high-volume production environment.
The successful candidate will bring deep expertise in semiconductor backend assembly processes, advanced packaging technologies, and engineering leadership. This position plays a critical role in supporting business growth, customer satisfaction, operational efficiency, and the successful execution of technology roadmaps across multiple manufacturing lines and sites.
Key Responsibilities
Engineering Leadership
- Lead and manage FOL & EOL Engineering teams responsible for process development, optimization, and manufacturing support.
- Define and execute engineering strategies aligned with business objectives and technology roadmaps.
- Build and develop a high-performing engineering organization focused on innovation, quality, and continuous improvement.
- Provide technical leadership across multiple production lines and manufacturing sites.
Process Engineering & Manufacturing Support
- Drive process stability, capability improvement, and manufacturing efficiency across FOL and EOL operations.
- Lead engineering initiatives to improve yield, throughput, cycle time, quality, and cost performance.
- Ensure robust process controls and engineering standards are implemented and maintained.
- Support production ramp-ups, technology transfers, and new customer programs.
Advanced Packaging Technologies
- Lead engineering support for advanced semiconductor packaging technologies.
- Drive the introduction and qualification of new assembly processes, materials, and equipment.
- Collaborate with R&D, Product Engineering, Manufacturing, and Quality teams on technology deployment.
- Evaluate emerging packaging and assembly technologies to enhance competitive advantage.
Yield & Continuous Improvement
- Establish systematic yield improvement programs through data analysis and root cause investigation.
- Lead corrective and preventive action initiatives to address process-related issues.
- Drive Lean Manufacturing, Six Sigma, and operational excellence initiatives.
- Develop engineering solutions that improve productivity, quality, and cost performance.
Customer & Stakeholder Management
- Act as the key engineering interface for customers regarding process capability, quality, and technical requirements.
- Support customer audits, engineering reviews, and technical discussions.
- Work closely with cross-functional teams to ensure successful execution of customer programs.
- Ensure engineering readiness for customer technology and business requirements.
People Development
- Lead, mentor, and develop engineering managers, technical experts, and engineering teams.
- Strengthen engineering capabilities through training, coaching, and succession planning.
- Foster a culture of accountability, collaboration, innovation, and continuous learning.
- Promote employee engagement and high-performance leadership practices.
Qualifications
Education
- Bachelor's Degree in Engineering, Electronics, Mechanical Engineering, Materials Science, or a related field.
- Master's Degree is an added advantage.
Experience
- Minimum 15–20 years of semiconductor manufacturing experience.
- Minimum 8–10 years in engineering leadership or senior management roles.
- Strong experience in:
- Semiconductor backend assembly engineering
- FOL & EOL process engineering
- Advanced packaging technologies
- High-volume manufacturing environments
- Proven experience managing:
- Large engineering organizations
- Cross-functional engineering teams
- Multi-site or multi-line engineering operations
- Global customer engineering requirements
