Job Title: Engineer Design II
Location: Virtual Site MYS PEN (B19)
Work Mode: Fully Remote
Job Description
As an IC Package Design Engineer, you will be responsible for executing high-density package layout designs, including Test Chips, CPUs, Chipsets, SoCs, and Test Vehicles.
Key Responsibilities:
- IC package layout design, including:
- Routing feasibility studies
- Signal breakout and full-path routing
- Length matching (Group/Differential Pairs) for Low-Speed and High-Speed I/Os (DDR, PCIe, SERDES)
- Power routing and package ball map assignment
- VSS stitching (vertical and horizontal)
- Design Rule Checks (DRC) and cleanup (Mentor DRC, PLA eDRC)
- Adhesion hole generation and touch-up
- Routing over void report generation and fixes
- Return path report generation and cleanup
- Use Mentor Graphics Xpedition PCB to design substrates in compliance with design rules, electrical requirements, and processes.
- Collaborate with assigned PDEs to deliver package design milestones on time with high design quality.
Requirements
- Bachelor's or Master's degree in Electrical/Electronics Engineering or related discipline.
- 3+ years of relevant experience.
- Hands-on experience with Mentor Graphics Xpedition PCB.
- Strong communication skills in English.
- Good time and task management skills.
Good to Have
- Knowledge of interface requirements such as DDR, PCIe, SERDES.
- Strong foundation in electrical theory and electronic fundamentals.
- Knowledge of electromagnetic and microwave theory is a plus.
