As a IC Package Design Engineer, you will be responsible for executing high density package layout designs across product portfolios (Test Chips, CPUs, Chipsets, SoC designs, Test Vehicles and more)
The responsibilities include but not be limited to:
1.IC package layout design including
- Routing feasibility studies
- Signal breakout & full path routing, including Length matching (Group/ Diff Pair) for Low-Speed IOs and High-Speed IOs (e.g. DDR, PCIe, SERDES)
- Power routing
- Package Ballmap assignment
- VSS Stitching (Vertical/ Horizontal)
- Design rule checks (DRCs) and DRC cleanup (e.g. Mentor DRC and PLA eDRC)
- Adhesion hole generation and touchup
- Routing over void report generation and fixes
- Return path report generation and cleanup
2.Using the Mentor Graphics Xpedition PCB software to design the substrate in compliance with existing design rules, electrical requirements, and processes.
3.Work together with assigned PDE to deliver Package design milestones on time and with the expected design quality.
Requirement:
- Should possess a Bachelor, Master in Electrical/ Electronics Engineering or relevant disciplines with 3+ years in the related fields.
- Experienced in using Package/Board CAD layout design and software tool: Mentor Graphics Xpedition PCB.
- Able to communicate well in English.
- Good Time and Task management to complete tasks ahead or on schedule, while meeting expectations.
Good to have:
- Understand various interface requirement like DDR/PCIe/SERDES etc.
- Good technical knowledge of electrical field theories and electronic fundamentals. Those with sound knowledge in electromagnetic and microwave theory are encouraged to apply
