To support our extraordinary teams who build great products and contribute to our growth, we're looking to add a Manager CPO Development located in Perai, Penang
What a typical day looks like:
- Holding up on mechanical, electrical, and testing of product design for a new and rapidly growing division within Flex. Work in comprehending the product requirements, assembling prototypes for products under development, fixture creation for assembly and test of prototypes. Implementing world class solutions for our customers.
- Working with a matrixed, cross functional team of technical experts within Flex organization, extending and building new resources/ capabilities to incorporate into the Flex knowledge base.
- Drive toward creative, robust, and effective solutions that meet customer requirements.
- Hold up engineering team with prototyping, product build, bring up, test, documentation, and successful release to manufacturing.
- Contribute with a cross functional team to develop technically robust and effective solutions to a wide variety of design problems.
- Manage design parameters and design tradeoff priorities in close coordination with other team members.
- Help develop best practices, identify equipment, and material needs with members of the team.
- Ability to resolve, define and design the system and subsystems approaches to meet project and program design goals, requirements and schedules.
- Identify standard products and sub-blocks for inclusion into solution proposals.
- Develop key relationships with internal design teams as well subcontractors to plan comprehensive product strategies based on future technologies.
- Strives for improvements and efficiencies in Engineering area.
- Monitors KPIs for engineering processes.
- Maintains up-to-date knowledge of technical development and trends in the field of expertise.
The experience we're looking to add to our team:
- Possesses a Degree in related discipline or equivalent experience.
- Minimum 10 years in semiconductor packaging, photonics, or optical module assembly
- Hands-on experience with CPO, transceiver packaging, or optical engine integration.
- Exposure to switch ASIC + optical engine co-integration (co-packaging roadmap).
- Strong hands-on experience with fiber cleaning, routing, and inspection processes.
- Exposure to cleanroom practices (ISO Class 1000 / 10000 environments)
