Principal Engineer, Process

Position Overview

The Process Engineer (Middle-of-Line focus with Front-of-Line knowledge) will be responsible for developing, optimizing, and sustaining MOL processes in optical engines and module assembly. This role ensures seamless integration with FOL processes to drive yield, quality, cost, and cycle time improvements. The engineer will collaborate with cross-functional teams and contract manufacturers to support high-volume production and new product introductions.

Responsibilities

1. Own and optimize MOL processes (chip/component attach, dispensing, reflow, solder ball jetting, transfer, pick & place).
2. Maintain working knowledge of FOL processes (die attach, flip chip, eutectic bonding, wire bonding).
3. Establish process parameters, control plans, and work instructions to ensure robust manufacturing.
4. Design and execute DOE for process optimization and perform SPC analysis to prevent excursions.
5. Perform process characterization, window definition, and robustness studies.
6. Lead yield improvement initiatives through root cause analysis (8D, Fishbone, FMEA).
7. Support NPI by defining process flows, tooling, materials, and leading process qualifications (IQ/OQ/PQ).
8. Collaborate with equipment engineers on specifications, installation, qualification, and troubleshooting.
9. Evaluate and qualify new materials (adhesives, substrates, fibers, components) for cost and performance optimization.
10. Develop and maintain documentation (process flows, WI, control plans, FMEA) ensuring ISO/quality compliance.
11. Train production personnel and CM partners on new processes and updates.
12. Provide technical leadership and collaborate with Product, Quality, Manufacturing, and Supply Chain teams to resolve process-related issues.

Requirements

1. Bachelor's or Master's degree in Electrical, Electronic, Mechanical, Mechatronics, or related engineering fields.
2. Minimum 12 years of experience in semiconductor, electronics, or high-tech manufacturing.
3. Strong knowledge of semiconductor assembly and photonics packaging, with hands-on MOL process expertise.
4. Ability to perform process characterization, window definition, and robustness studies.
5. Proficiency in DOE, SPC, FMEA, 8D, and yield/data analysis familiarity with optical testing and alignment is advantageous.
6. Strong analytical and problem-solving skills with effective communication across global and cross-functional teams.
7. Independent, proactive, and results-driven mindset in fast-paced environments exposure to silicon photonics or optical module packaging is a plus.