Define and develop the right package design & drafting methods and business processes for the package development of BE, BU and DES from concept, feasibility study until realization.
Your Role
Key responsibilities in your new role
- Driver for definition of general package design & drafting methods(Package design methods, tools and documentation, Package design workflow) for global BE DEV.
- Generate conceptual package design/construction method guidelines &work instruction documents, finalize the documents and roll-out to the global BE DEV organizations as needed.
- Driver for the deployment of latest package design/construction tools& methods to the global package designer community in alignment with BE management.
- Contact person and consultant/coach for all questions and discussion regarding package design & drafting methods, processes and guidelines &work instructions.
Your Profile
Qualifications And Skills To Help You Succeed
- Master Degree in Engineering (Microelectronics, Mechanical,Electrical) with 7 years of relevant working experience in IC/semiconductor environment.
- Profound knowledge in Semiconductor Packaging, Assembly and Test.
- Knowledge in Mechanical Construction Standards with AutoCAD and Inventor 3D.
- Knowledge in Process or Equipment Engineering preferred.
- Analytical and Problem Solving Skills.
- Able to be effectively communicate and engage global teams.
#WeAreIn for driving decarbonization and digitalization.
As a global leader in semiconductor solutions in power systems and IoT, Infineon enables game-changing solutions for green and efficient energy, clean and safe mobility, as well as smart and secure IoT. Together, we drive innovation and customer success, while caring for our people and empowering them to reach ambitious goals. Be a part of making life easier, safer and greener.
Are you in
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