Responsible for all SMT process and yield improvement, engineering problem solving and productivity promotion. Make decisions and take actions to support production process quality and yield
Drive process control, failure analysis and problem solving involving PCB assembly and soldering material.
Responsible for new process and equipment technology improvement.
Utilize Six Sigma methodology to identify critical parameter, analyze process gap and develop new process/ equipment technology to leap frog the current manufacturing capability.
Handle process improvement for ultimate yield and quality, less scrap and cycle time. Support scrap and waste elimination initiative. Drive error-proof solutions involving fixture design and automation to reduce human dependency and streamline process flow
Support new product introduction and transfer. Generate the build report .Utilize DFM tools to assess new product and ensure meeting manufacturing design guideline and best practices for flawless launch.
Experience of reflow , solder wave is advantageous
Experience of stencil design, pallet design, fixture design is advantageous
Qualifications & Requirements
Bachelor's degree preferably in Manufacturing/ Industrial/ Mechanical/ Material Engineering
Experience in Surface Mount Technology will be an advantage.
Knowledge in Material/ Metallurgy Failure Analysis (SEM, EDX etc) will be an advantage.
Knowledge in Statistical and Lean Six Sigma Methodology will be an advantage.
Knowledge in DFM with good understanding of PCB design guidelines will be an advantage.
Good interpersonal skills and ability to work independently in a dynamic environment.
