Process Engineer (Advanced Packaging- Fan Out)

Responsibilities:

• Do well in the process technology and maintenance of equipment and materials.
• Responsible for liaising with other teams to improve and implement their needs within the department.
• Process parameter debug and optimization
• Responsible for the work specification definition of production line OP and update the SOP
• Responsible for yield and SPC improvement
• Responsible for the optimization and maintenance of FMEA/OCPA/SPEC
• Evaluation of new materials and machines
• Identification and definition of product defects

Key Areas Involved:

• Photolithography; or
• Sputtering / Electroplating / Etching; or
• Yield / SPC improvement; or
• Grinding / Dicing; or
• FCBGA / COW

Requirements:

• Bachelor's degree in Science and Engineering related majors
• More than 3 year of experience in related key areas modules and wafer level processes
• Good communication in English and proficiency in MS office.
• Basic knowledge of FMEA and DOE.
• Understand SPC principles and possess the ability to perform relevant analyses.
• Master quality management knowledge and common analysis tools, including SPC, 8D, and DOE.
• Familiar with MSA.
• Acquire expertise in the process and workflow of relevant operations, understanding process requirements, product quality benchmarks, and the materials in use.
• Be well-versed in the performance, operation, and debugging methods of equipment.
• Understand electrostatic discharge precautions and requirements.
• Strong self-disciplined and teamwork skills.
• Able to work in Batu Kawan site