Set-up wafer bumping process recipe & its verification during internal & external (customer) qualification builds & HVM, review & update document, customer audit/visit support, engineering activities as yield improvement, productivity increment defect analysis & taking corrective action.
Job Responsibilities:
- Take charge of process control within the designated area, continuously optimizing existing processes to ensure product quality.
- Handle equipment faults and execute PM plans to maintain a smooth production workflow.
- Implement and verify cost reduction initiatives within the area of responsibility.
- Conduct validation work for new processes and materials within the designated area.
- Collaborate in the acceptance of newly purchased equipment within responsibility area.
- Manage equipment spare parts, including inventory, procurement, and technical verification.
- Oversee the management of tools, kits, dummy wafer, and similar resources within the designated area.
- Develop various operational manuals and guidelines for tasks within the designated area.
- Conduct training and assessments for operational staff within the designated area.
- Participate in TPM team activities.
Job Requirements:
- Education on SPC, DOE (miniTab or JMP), FMEA (Failure Mode & Effect Analysis)
- Process engineering experiences in semiconductor field
- Failure analysis & report with Englis.
- Be well-versed in the workflow, understanding process requirements and product quality benchmarks. Also familiar with the materials in use.
- Acquire expertise in the performance, operation, and debugging methods of relevant equipment.
