Work Location: Prai / Bayan Lepas
Job Responsibilities
- Management of product sustaining activities which include driving product performance improvement (yield, quality, etc.) and cost reduction
- Drive on VM yield improvement across processes. Manage yield performance with customer and work on baseline yield improvement
- Managing the sustaining process and executing independently BOM (Bill of Material) project for New Advanced Technology Products, Design of Experiment (DOE) and processes
- Managing the engineering activities during new product development including product definition, performance characterization, qualification, and release to production
- Manage product ramp to yield entitlement
- Managing the Quality matter with the approach of Statistical data analysis (Statistical Validation), 8 basic QC tools and FMEA
- Drive all margin issues with operations and development teams
- Work with the Manufacturing, Design, Quality, and equipment team in the disposition of product excursions and manage cases through a material review board
- Train, develop and retain Engineer with the sustaining process specialized in Flip Chip Ball Grid Array (FCBGA)
Job Qualification
- Require at least 5 years of experienced in IC packaging
- Candidate must possess at least Bachelor's Degree/Post Graduate Diploma/Professional Degree in Engineering (Computer/Telecommunication), Engineering (Electrical/Electronic), Engineering (Mechanical), Engineering (Mechatronic/Electromechanical) or equivalent
Required Skills
Preferred Skills
- Preferred to have some fundamental levels of knowledge in vision inspection equipment, PnP handler, mechanical design.
