
Search by job, company or skills

We are seeking a Process Engineer with a minimum of 2 years of hands-on experience in semiconductor back-end assembly processes, particularly die bonding and wire bonding. The successful candidate will be responsible for process setup, optimization, yield improvement, and troubleshooting to ensure stable and high-quality manufacturing performance.
The role requires strong technical understanding of back-end equipment, materials, and process interactions, as well as the ability to analyze data, drive continuous improvement, and support production operations.
Key Responsibilities
Additional Advantage:
Renesas is an embedded semiconductor solution provider driven by its Purpose To Make Our Lives Easier. As the industry's leading expert in embedded processing with unmatched quality and system-level know-how, we have evolved to provide scalable and comprehensive semiconductor solutions for automotive, industrial, infrastructure, and IoT industries based on the broadest product portfolio, including High Performance Computing, Embedded Processing, Analog & Connectivity, and Power.
With a diverse team of over 21,000 professionals in more than 30 countries, we continue to expand our boundaries to offer enhanced user experiences through digitalization and usher into a new era of innovation. We design and develop sustainable, power-efficient solutions today that help people and communities thrive tomorrow, To Make Our Lives Easier.
At Renesas, you can:
Are you ready to own your success and make your mark
Join Renesas. Let's Shape the Future together.
Renesas Electronics is an equal opportunity and affirmative action employer, committed to supporting diversity and fostering a work environment free of discrimination on the basis of sex, race, religion, national origin, gender, gender identity, gender expression, age, sexual orientation, military status, veteran status, or any other basis protected by law. For more information, please read our Diversity & Inclusion Statement.
Job ID: 150596871
Skills:
manufacturing process control techniques, statistical process control methods and tools, semiconductor equipment manufacturing process control, process improvement, process characterization, equipment monitoring and adjustment, problem-solving methodologies
Skills:
Power Bi, Excel, Sql, S4, Data Analysis
Skills:
wafer thinning, DOE matrix design, Spc, Process Optimization, wafer grinding, wafer dicing, silicon photonic chips, Jmp
Skills:
Best practices in mechanical assembly and assembly jig fixture design, Ultrasonic resistance welding and heat staking process, Poka-yoke design and Design for Assembly guideline design rules, SMT process for Flex and PCBA, SMT DFM process, Mechanical assembly process, Vacuum leak test requirement and troubleshooting
Skills:
equipment qualification, variability reduction, failure investigation, Spc, Process Control, Mechanical systems and material behavior, Doe, Root-cause analysis, CPK, Production ramp
We don’t charge any money for job offers