Product Engineer Die Fab (Ipoh)

Job Summary:

To provide technical support and data analysis on product related issues and product improvements (Cost and Yield). Handles new product transfers from NPI to mass volume production lifecycle. Prepares product engineering documentation and engineering related changes with related revision change. Supports pilot manufacturing line in the assembly, testing and evaluation of new products. Collaborates with FMT Team and Sweden Team and participate in qualification, and implementation of new test processes/system. Drives efforts in product re-engineering, cost reduction, yield improvement, quality and reliability improvement. Supports and initiates ECOs, BOM changes, test processes, procedures and specification modifications. Conducts data analysis and statistics pertaining to product performance and quality improvements.

JOB REQUIREMENTS:

• A Bachelor's degree in Electronics/Electrical, Communications, Mechatronics or Applied Science in Physics or its equivalents
• At least 3 years of relevant work experience in PCBA, Semiconductor devices, IC fabrication manufacturing environment and Product Testing.

JOB RESPONSIBILITIES:

• Responsible to monitor and drive product improvements pertaining to manufacturing yields and cost.
• Responsible to initiate and conduct evaluations and qualifications pertaining to product quality and improvements.
• Responsible to do in-depth failure analysis on failure parts and drive improvements on yields and cost as needed.
• Responsible to coordinate and work with the team for weekly yield reporting.
• Experience working in Wafer fabs, Semiconductor devices, IC fabrication manufacturing environment and Product Testing.
• Good knowledge in BOM maintenance, statistical quality tools and problem analysis
• Strong technical knowledge and ability to trouble shoot product and initiatives to drive performance goals.
• Experience on New Product (NPI) qualifications and transfer is an advantage.