Search by job, company or skills

Adecco Group

Product Specialist (Semiconductor)

Save
new job description bg glownew job description bg glownew job description bg svg
  • Posted 19 hours ago
  • Be among the first 10 applicants
Early Applicant

Job Description

About Our Client:

Our client, a global leader in semiconductor backend solutions, is seeking a Product Specialist (SSI & FC) to support technical product management, customer engagement, and pre- and post-sales activities. This role covers Soft Solder Interconnect (SSI) and Flip Chip (FC) technologies and works closely with Sales, R&D, Engineering, and regional support teams.

Responsibilities:

  • Collect process, production, and competitor data at customer sites to support product positioning and development
  • Identify, evaluate, and report new product ideas and innovations to enhance the product and service portfolio
  • Support product introduction and market launches for SSI, FC, and AFC models, including demos, evaluations, and semiconductor exhibitions
  • Conduct feasibility studies and support customer sample build requests
  • Participate in R&D projects, including product definition, requirements engineering, and in-house and on-site testing
  • Define and document software requirements for new modules and features using JIRA
  • Support Sales teams and Customer Program Managers (CPMs) during pre-sales activities, benchmarks, and technical discussions
  • Establish and maintain strong technical relationships with key customer accounts
  • Investigate and troubleshoot technical issues at customer sites, coordinating with Software and Hardware Engineering teams for timely resolution
  • Conduct technical training and knowledge transfer sessions for Field Service Engineers (FSEs) and customers; maintain demo equipment when required

Requirements:

  • Degree in Mechanical Engineering, Electrical Engineering, or Mechatronic Engineering
  • At least 3 years experience in a product support or technical support role with customer-facing exposure
  • Experience in the semiconductor backend industry is required
  • Soft Solder (SSI) process/application experience is an advantage
  • Flip Chip (FC) process/application experience is an advantage
  • Experience with the following platforms is a plus:
  • Esec 2009 / 2100
  • Datacon 8800
  • Customer-oriented mindset with professional conduct
  • Strong adaptability and flexibility in a fast-paced environment
  • Intercultural awareness and ability to work with regional and global teams
  • Willingness to travel up to 50%

Motivated candidates who are seeking a new technical challenge and career growth opportunity in a global semiconductor environment are encouraged to apply.

More Info

Job Type:
Function:
Employment Type:

About Company

Job ID: 147311009