The QualiFind Group is managing a worldwide search for a Research & Development Director for our clients manufacturing site in Tijuana, Baja California. We are seeking a senior-level candidate with specific experience in the back-end semiconductor business. ALL INTERNATIONAL CANDIDATES ARE INVITED TO PARTICIPATE.
We are seeking a highly accomplished R&D Director to lead innovation and technology development for a global semiconductor manufacturer specializing in packaged back-end components for the automotive and industrial sectors. This individual will drive advanced packaging strategies, new product development, and innovation initiatives that strengthen the companys market leadership in performance, reliability, and cost competitiveness.
Key Responsibilities
- Set and execute R&D strategy for semiconductor packaging, ensuring alignment with automotive and industrial market needs, customer requirements, and corporate objectives.
- Lead advanced packaging technology development, including materials, processes, and reliability engineering, to deliver differentiated products.
- Oversee new product introduction (NPI), from concept and feasibility through prototyping, qualification, and volume production.
- Drive innovation pipelines by scouting emerging technologies, building collaborations with universities, suppliers, and research institutes, and expanding the companys intellectual property portfolio.
- Ensure compliance with industry standards, customer requirements, and regulatory frameworks (e.g., automotive quality standards, industrial certifications).
- Partner closely with global manufacturing and operations to ensure seamless technology transfer and scalable implementation.
- Engage directly with customers to understand evolving needs, co-develop solutions, and strengthen technology partnerships.
- Develop and mentor high-performing teams, fostering a culture of innovation, technical excellence, and continuous improvement.
Experience & Background
- 10+ years of progressive leadership in R&D, engineering, or technical management, with (back-end) semiconductor industry experience strongly preferred.
- Proven ability to lead cross-functional, multicultural, and global teams, fostering collaboration across geographies.
- Deep expertise in semiconductor packaging technologies, materials, and back-end assembly processes, with a strong understanding of semiconductor electronics and digital transformation.
- Demonstrated track record of translating technology into commercially viable solutions and driving competitive differentiation.
Leadership & Management
- Demonstrated success in building, scaling, and developing high-performing R&D organizations.
- Effective stakeholder management skills, engaging with global customers, suppliers, and internal leadership.
- Strong communicator, able to bridge technical depth with business strategy and influence at the executive level.
- Strategic mindset with focus on execution, innovation pipelines, and portfolio management.
Education
- Bachelors degree in Engineering, Materials Science, Physics, or related technical field required.
- Masters or PhD strongly preferred, particularly with specialization in semiconductor technologies or advanced packaging.
