Conduct die attach process development for new products, including parameter optimization and process validation Development of innovative processes and process characterization methodologies for existing and new technologies.
Your Role
Key responsibilities in your new role
- Development of innovative processes and process characterization methodologies for existing and new technologies.
- Collaborate with manufacturing and equipment teams to ensure robust process integration.
- Support prototype and development samples build.
- Perform risk assessment & identify technical challenges.
- Support equipment qualification and setup for new bonding technologies (e.g., Die Attach, Clip Bond, Reflow Oven & etc)
Your Profile
Qualifications And Skills To Help You Succeed
- Masters/Bachelor's Degree in Engineering or relevant course.
- 3 years working experience in semiconductor manufacturing industry or other relevant industry.
- Strong hands-on knowledge and skills in FOL process/ Die Attach process.
- Familiarity with DACA is a plus.
#WeAreIn for driving decarbonization and digitalization.
As a global leader in semiconductor solutions in power systems and IoT, Infineon enables game-changing solutions for green and efficient energy, clean and safe mobility, as well as smart and secure IoT. Together, we drive innovation and customer success, while caring for our people and empowering them to reach ambitious goals. Be a part of making life easier, safer and greener.
Are you in
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This means we embrace diversity and inclusion and welcome everyone for who they are. At Infineon, we offer a working environment characterized by trust, openness, respect and tolerance and are committed to give all applicants and employees equal opportunities. We base our recruiting decisions on the applicants experience and skills. Learn more about our various contact channels.
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