To define and develop the right package for new products/technologies from BU/FE from concept, feasibility study until realization.
Your Role
Key responsibilities in your new role:
- Driver for technical definition (BOM, package design, Assembly technology, review PRP, project classification) activities for package projects with major changes/new package, risks and impact.
- Generate conceptual package outline and internal construction drawings, finalize and document the drawings and update the package drawings as needed.
- Define the package characteristic to meet the electrical, thermal, reliability and mechanical requirements.
- Coordinate the package Cost Estimation (A1-A3) and Cost Indication (A3).
- Contact partner and technical consultant for package definition to Business Division especially on BE assembly technology know how.
- Support pre development & project definition stage, and continue to be package design expert throughout project phase.
Your Profile
Qualifications and skills to help you succeed:
- Bachelor's Degree in Engineering (Semiconductor Technology, Microelectronics, Automation, Mechanical, Electrical, Electronics Physics).
- At least 2-3 years of relevant working experience in IC/semiconductor environment.
- Semiconductor Packaging, Assembly and Test.
- Process and Equipment Engineering knowledge.
- Failure Analysis and Reliability Engineering.
- AutoCAD and 3D drafting preferred.
#WeAreIn for driving decarbonization and digitalization.
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Are you in
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