Description
Job Description
We're hiring a hands-on Resident Package Engineer at a key OSAT partner to support mass production of multi-die wirebond leadframe packages. You will focus on sustaining manufacturing performance, supplier process control, and robust release-to-manufacturing (RTM) protocols to ensure product quality, yield and on-time delivery.
Key Responsibilities
- Act as the on-site technical owner at the OSAT for all packaging activity; act as primary engineering interface between OSAT operations and our packaging / product teams.
- Support and troubleshoot day-to-day production issues (quality holds, yield excursions) and lead root-cause analysis and permanent corrective actions (8-D, RCA).
- Implement and maintain RTM artifacts including process flows, control plans, work instructions, and SOPs.
- Drive process control and SPC: define control charts, sample plans, capability studies (Cp/Cpk) and guardbanding for critical steps (die attach, wirebond, mold, trim/form, plating).
- Oversee supplier change control and PCNs (Process Change Notices), BOM/process releases and supplier qualification runs.
- Participate in supplier audits and periodic process/quality audits at the OSAT; capture and escalate nonconformances.
- Run process characterization and DOE to improve yield, quality, capacity, and cycle time; document outcomes and update process specs.
- Coordinate failure analysis and disposition of discrepant material (with material review board support).
- Work with NPI and sustaining teams to transfer new or revised processes into consistent mass production practices.
- Report KPIs weekly (yield, DPPM, escape rate, cycle time, open corrective actions).
Required Qualifications
- B.S. in Electrical, Mechanical, Materials, Chemical engineering or related discipline.
- Minimum 2 years experience in semiconductor back-end assembly — volume production experience required.
- Strong practical knowledge of wirebond processes, leadframe design considerations, clip bonding, plating and molding/encapsulation.
- Strong problem solving using 8-D, FMEA, DOE, SPC
- Experience with QC/FA tools (cross-section, decap, SEM, X-ray) and reading FA reports.
- Excellent communication skills — able to write process specs
- Willingness to be based full-time at the OSAT site with occasional travel to Malaysian operations hub in Penang.
Additional Preferred Qualifications
- Direct experience producing power packages or automotive qualification work.
- Knowledge of AEQ Automotive reliability requirements
- Knowledge of APQP automotive development process
- Knowledge of JEDEC/IPC standards
- Ability to work in a fast-paced environment
- Able to occasionally work with colleagues in the US timezone
