Senior PCB Design Engineer

Key Responsibilities

1. Advanced PCB Design & Layout: Execute advanced layout for complex, high-density, and high-speed multi-layer boards (including HDI, blind/buried vias, and microvias).
2. Perform rigorous constraint management for critical high-speed interfaces such as DDRx, PCIe, LVDS, etc.
3. Optimize component placement for signal integrity (SI), power integrity (PI), thermal performance, and EMI/EMC control.
4. Develop high-quality designs for various board types, including rigid, flex, and rigid-flex configurations.
5. Closely collaborating with electrical and mechanical teams to interpret requirements, resolve design issues, and implement simulation-driven layout changes.
6. Work with PCB fabrication to ensure Design for Manufacturing (DFM) standards are met, optimizing stack-up, maximizing manufacturing yield, and reducing cost.
7. Prepare and maintain comprehensive documentation packages for product release, including schematic diagrams, detailed assembly and fabrication drawings, Bills of Materials (BOMs), Gerber files, and ODB++ outputs.
8. Maintain ECAD library, including the creation of precise schematic symbols and component footprints.
9. Leverage CAD automation tools, with proficiency in Allegro SKILL scripting being a significant advantage, to enhance team efficiency and design quality.
10. Perform layout planning and design reviews.

Required Qualifications

1. Experience: Minimum of five (5) years of professional, direct experience in complex PCB design and layout. Experience in industrial modules, power electronics, medical devices, and aerospace applications is highly desirable.
2. Education: Bachelor's Degree in Electrical Engineering, Electronics Engineering, or a related technical field.
3. Software Expertise: Proficiency in industry-leading CAD systems, including Cadence Allegro/OrCAD and/or Altium Designer.
4. Standards Knowledge: In-depth expertise in industry standards for PCB fabrication and assembly (e.g., IPC standards).
5. Technical Acumen: Strong understanding of high-speed design techniques, impedance control, stack-up planning, and thermal/mechanical constraints.