Senior SI/PI Packaging Engineer

• Master's degree or higher in Microelectronics / Electronics / Automation or related field
• Minimum 5+ years of SI/PI (Signal & Power Integrity) experience
• Strong hands-on experience in packaging or system-level SI/PI simulation
• Deep understanding of SI/PI fundamentals and transmission behavior
• Proven experience using HFSS, SIWAVE, ADS, PowerSI, HSPICE or equivalent tools

Core Technical Expectations

• Ability to analyze and optimize high-speed signal paths and power delivery networks
• Strong experience in DDR / SerDes SI simulation and validation
• Capability to interpret and extract simulation results (eye diagram, TDR, S-parameters, PDN analysis)
• Experience supporting package design optimization and layout guidance
• Ability to document simulation results and provide engineering recommendations

Highly Preferred

• Experience in advanced packaging design environments
• Exposure to IP development support and SI/PI standard definition
• Strong communication skills with design teams and external stakeholders
• Hands-on experience in system-level co-design (chip + package + board interaction)
• Experience participating in design reviews and architectural discussions

Interested candidates please share updated CV to [Confidential Information]

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